$225 million for Kandou AI to power the next era of AI connectivity

As AI models grow larger and more complex, memory and interconnect bandwidth have become the main constraints in high-performance computing. Traditional networking and interconnect technologies, designed for a pre-AI era, are increasingly unable to keep up. Kandou AI, a Venture Kick alumnus and ranked among the Top100 Swiss Startups for several years in a row, has developed patented silicon and signaling technologies engineered to overcome these bottlenecks, delivering higher bandwidth, longer reach, and improved energy efficiency compared with traditional copper interconnects.
 

"Venture Kick was instrumental in the early days. It gave us not only the funding to move from simulation to first silicon, but also the structure and visibility to refine our business case."
Amin Shokrollahi, Co-Founder and CEO of Kandou AI

The $225 million funding will allow Kandou AI to scale production of its high-performance connectivity chips, expand partnerships with hyperscale and AI infrastructure customers, and accelerate the development of its next-generation chip and IP portfolio to enable multi-terabit connectivity. The company has recently achieved key milestones, including the tapeout of its next-generation SerDes technology, growth in its retimer business, the opening of a new design center in Hyderabad, India, and the addition of industry veterans to its leadership team.

By rethinking how data moves across copper interconnects, Kandou AI is enabling more efficient, cost-effective AI systems, supporting broader adoption of AI infrastructure worldwide.

"The staged support of Venture Kick forced us to focus on milestones, sharpen our story, and engage with a network of mentors and investors. That combination, capital plus guidance, helped transform a research idea into a company ready to compete in the semiconductor industry," highlighted Amin.

Kandou: COO Taher Madraswala, CEO and co-founder Srujan Linga, and CTO and co-founder Amin Shokrollahi