Kandou successfully raises USD 72 Million in first close of series E round
15.09.2023
On August 24th, 2023, Kandou, a forward-thinking company based in Vaud specializing in high-speed, top-tier signal conditioning solutions, celebrated a successful first closing of its USD 100 Million equity funding round. This noteworthy achievement marks a crucial phase in Kandou's journey, enabling the company to pursue ambitious market expansion endeavours, strengthening its foothold as a prominent figure in the semiconductor industry.
 Kandou's team
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Kandou is a fabless semiconductor company that offers differentiated and fundamental interconnect technology. Beyond creating semiconductors for advanced USB and PCIe applications, Kandou's silicon and IP solutions enhance wired connectivity by reducing power consumption and boosting performance. Their revolutionary chip-to-chip solutions have already revolutionized data transmission, offering unmatched efficiency and performance.
This recent funding infusion will empower Kandou to expedite its global expansion initiatives and introduce Regli, a member of the multiprotocol retimer family designed for PCI Express 5.0 specification and CXL 2.0. Regli enhances the physical connection quality, minimizes latency, and enhances security for PCIe and CXL interfaces, making it an ideal solution for data centres and hyperscale computing environments dealing with intensive workloads. These centres frequently rely on PCIe technology and CXL as the primary interfaces for connecting host processors, GPUs, AI accelerators, CXL memory modules, and SSD storage. Regli also finds applications in servers, workstations, desktops, 5G infrastructure equipment, networking gear, PCIe and CXL storage, and PCIe active cables.
Amin Shokrollahi, CEO and founder of Kandou, expressed enthusiasm about the strong support received from investors, highlighting that this financing round underscores the value of their technology in delivering high-speed connectivity solutions. They are raring to utilize this funding to make their solutions available to a broader global customer base. Additionally, there are plans for a second funding round totalling USD 27.7 Million later this year.
Kandou won Venture Kick Stage 3 in 2011 and was ranked in the TOP 100 Swiss Startup Award from 2011 to 2016.
This recent funding infusion will empower Kandou to expedite its global expansion initiatives and introduce Regli, a member of the multiprotocol retimer family designed for PCI Express 5.0 specification and CXL 2.0. Regli enhances the physical connection quality, minimizes latency, and enhances security for PCIe and CXL interfaces, making it an ideal solution for data centres and hyperscale computing environments dealing with intensive workloads. These centres frequently rely on PCIe technology and CXL as the primary interfaces for connecting host processors, GPUs, AI accelerators, CXL memory modules, and SSD storage. Regli also finds applications in servers, workstations, desktops, 5G infrastructure equipment, networking gear, PCIe and CXL storage, and PCIe active cables.
Amin Shokrollahi, CEO and founder of Kandou, expressed enthusiasm about the strong support received from investors, highlighting that this financing round underscores the value of their technology in delivering high-speed connectivity solutions. They are raring to utilize this funding to make their solutions available to a broader global customer base. Additionally, there are plans for a second funding round totalling USD 27.7 Million later this year.
Kandou won Venture Kick Stage 3 in 2011 and was ranked in the TOP 100 Swiss Startup Award from 2011 to 2016.