SenSiC is dedicated to the development, production and commercialization of real-time
beam sensors for harsh environments that are based on the semiconductor material silicon
carbide. Owing to its vast experience with SiC technologies as well as its unique capability of
a new wafer thinning technique - a fundamental process step for fabricating beam monitors
with high beam transparency and beam linearity - SenSiC is expected to play a pivotal role in
the expanding accelerator business. Despite its young age, SenSiC has already established
a strong network across universities, research institutes and beamline facilities, providing first-hand information on recent developments in the X-Ray monitoring field and a close interaction
with future customers of SenSiC.