Miraex awarded CHF 2.8M to head for mass manufacturing
02.12.2020
Miraex, a pioneer in photonic sensing solutions, has been awarded a CHF 2.8M project from the Swiss and Brazilian Innovation Agencies (Innosuisse and Embrapii), as part of a larger collaboration with EPFL, HEIG-VD, Instituto Eldorado and Chipus Microelectronics, to miniaturize its photonic sensor edge controller for mass scaling.
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Miraex offers photonic and quantum solutions for next-gen sensing, networking and computing. Their solutions allow you to make data-driven maintenance decisions, reducing costs and optimizing productivity in conditions where electronics can't operate.
The CHF 2.8M will in particular address two fronts simultaneously: the co-design of an Application-Specific Integrated Circuit (ASIC) with a custom Photonic Integrated Circuit (PIC). Jose Pozo, director of technology at the European Photonics Industry Consortium (EPIC) says "PICs will get smaller, cheaper and more efficient. Europe has world leaders in all technologies needing for PIC-enabled solutions to be deployed in new applications ranging from medical to autonomous cars”.
With the support received, Miraex will be able to reduce its edge controller size and production cost to reach the volumes necessary to address markets such as aerospace, industry 4.0, and automotive with digital sensing solutions. The same technology platform is also at the heart of Miraex quantum sensing and networking products.
Miraex has been supported by both Venture Kick and TOP100
The CHF 2.8M will in particular address two fronts simultaneously: the co-design of an Application-Specific Integrated Circuit (ASIC) with a custom Photonic Integrated Circuit (PIC). Jose Pozo, director of technology at the European Photonics Industry Consortium (EPIC) says "PICs will get smaller, cheaper and more efficient. Europe has world leaders in all technologies needing for PIC-enabled solutions to be deployed in new applications ranging from medical to autonomous cars”.
With the support received, Miraex will be able to reduce its edge controller size and production cost to reach the volumes necessary to address markets such as aerospace, industry 4.0, and automotive with digital sensing solutions. The same technology platform is also at the heart of Miraex quantum sensing and networking products.
Miraex has been supported by both Venture Kick and TOP100