Four new Swiss startups win CHF 10,000!

16.05.2018

Congratulations to Exomotion (Transportation Technologies), Socialease (AI), Touchless Automation (Industrial Automation) and UNISERS (Nanotechnology) on passing the first stage of Venture Kick. After each winning CHF 10,000, the startups are getting ready for the next stage.

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Exomotion
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Socialease
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Touchless Automation
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UNISERS
Exomotion (UNIGE) - Transportation Technologies / Robotics
Exomotion conceived a novel individual transporter called Virage. The electrical board with new motion sensation is destined to young generations, skateboarders and tech lovers. The wheeled motion mechanism enables the board to go in any direction and rotate immediately. The cognitive-ergonomic design for the steering system is also user-friendly and customizable allowing for an improved user experience.

Socialease (EHL) -  AI / SaaS / Social Media / Hospitality
Socialease developed an intelligent assistant supporting hospitality businesses in the management of their digital communication channels. Designed for small and medium businesses' owners, the software acts as an assistant by centralizing all digital interactions on social media, suggesting ready-to-use communication subjects, and allowing businesses' owners to easily control their e-reputation and develop their visibility on multiple social media.

Touchless Automation (EPFL) - Industrial Automation / Semiconductor / Optoelectronics / Aerospace
Touchless Automation is the pioneer in contactless micro handling. Located in the heart of the Swiss Watch Valley, its aim is to provide contactless manipulation solutions to improve the production yield of any industry dealing with micro components assembly.

UNISERS (ETH Zurich) - Nanotechnology / Engineering
UNISERS created a fully-automated universal chemical sensor capable of identifying multiple and different impurities in water. This technology will help the semiconductors industry to maintain the purity level of the rinsing water in the chip production, eventually improving the reliability and the manufacturing yield of the chips. 

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